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Research

From developing and deploying the first COTS standard switch fabric to driving the standard for data parallel CORBA, Mercury is committed to continued technology leadership. Several of our current areas of research are listed below.
  • Polymorphous Computing Architectures (PCA)
    http://www.darpa.mil/ipto/Programs/pca/index.htm
    The PCA program will develop a revolutionary approach to implementing embedded computing systems to support reactive multi-mission, multi-sensor, and in-flight retargetable missions. Payload adaptation, optimization, and verification will be reduced from years to days to minutes. The PCA program breaks the current failure-prone development approach of hardware first and software last by moving beyond conventional silicon to flexible polymorphous computing systems.

  • Power Aware Computing/Communications (PAC/C)
    http://www.darpa.mil/ipto/Programs/pacc/index.htm
    The PAC/C program will provide a novel integrated software/hardware technology suite incorporating innovative individual power reduction technologies. This will enable embedded computing systems to reduce power requirements up to 100X - 1000X as measured by energy-delay product or performance-per-watt metrics.
  • VLSI Photonics
    http://www.darpa.mil/mto/programs/nlmmsm/index.html
    The primary goals of the VLSI Photonics program are to establish the basic technologies that will bring the benefits of optics to chip-scale interconnections, and to demonstrate the use of these technologies in image processing.
Mercury has recently completed the following DARPA-sponsored research programs:
  • OMNET's (Optical Micro-NETworks) "Cost-Effective Embedding of High-Performance Optical Interconnect" (ChEEtah) with Honeywell, 3M, General Dynamics, Northrop Grumman, Boeing, USC and UCSB
  • PONI (Parallel Optical Network Interconnect) with Hewlett Packard (Agilent), Harris, MDA (Boeing), USC, SDL and Boston Optical Fiber
  • 3D OESP (OptoElectronic Stacked Processors) Consortium with UCSD, UNCC, UCLA, UCSB, GIT, Irvine Sensors, Honeywell and Kopin
  • "Three Final Steps toward Portability"
  • "Bridging the Development Gap"
 
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