Specifications
Module
FPGA compute nodes: 3
FPGA processor: Xilinx XC2VP70-6
SRAM
Capacity per FPGA: 32 MB
Bandwidth per FPGA: 5.6 GB/s full-duplex (peak)
DRAM
Capacity per FPGA: 128 MB
Bandwidth per FPGA: 2.8 GB/s (peak)
Parallel RapidIO ports per FPGA: 1
Fiber links
2 pairs at 10 Gbaud each, full-duplex (1 on each of 2 FPGAs)
850 nm multi-mode fiber with LC connectors
Copper serial links per FPGA
5 at 3.125 Gbaud to each other onboard FPGA, full-duplex
4 at 3.125 Gbaud off-board
(12 total to front panel)
LVDS lines per FPGA
8 pairs to two front-panel connectors
(24 pairs total)
Electrical/Mechanical
Input voltage
48 VDC
5V (for system management)
Power: 190W (typical max, depends largely on application IP)
Dimensions: M155 format
Slot spacing: 1.057 in
Environmental
Minimum airflow* (per slot at sea level)
28 CFM per stacked pair
Temperature*
Operating: 0°C to 35°C
Storage: -55°C to +85°C
Rate of change: 5°C/min
Humidity: 5-95% (non-condensing)
Vibration
Random: 0.02g²/Hz, based on 20 to 2,000 Hz, 1 hr/axis
Shock: 50g in all axes, 11 msec, half-sine
Altitude*
Operating: 0 to 30,000 ft
Storage: 0 to 50,000 ft
Salt/Fog: Consult factory
*As altitude increases, air density decreases and, therefore, the cooling effect of a particular number of CFM decreases. Different limits can be achieved by trading among altitude, temperature, performance, and airflow. Contact Mercury for more information.