• Designed for rugged deployments with o-ring sealing, high-reliability connectors, extended temperature ranges, and module wedge locks
• Single-board computing modules, coupled with dedicated I/O daughtercards
• High-performance computing modules featuring the latest FPGAs
• GPU modules
• SATA hard disk or solid state storage drives
• Fully loaded system provides up to 4,000 GFLOPS of compute performance
• 4 lanes of PCI Express bandwidth via switched backplane to each of the up to six plug-in modules

• Ultra-compact embedded computing chassis
• Full-size chassis performance in 1/9 the volume of full ATR, 1/6 the volume of short ATR for SWaP-constrained applications
• Six processing slots provide up to 4,000 GFLOPS per system
• State-of-the-art liquid or conduction or convection cooling for up to 300W power, designed for ruggedized deployments in harsh environments
• Designed for ruggedized deployments in harsh environments

Physical
Size (excluding connectors)
   120 mm x 149 mm x 148 mm (4.7” x 5.8 ” x 5.8”)
Weight (excluding connectors)
   No slots populated: ~2.5 kg (5.5 lb)
   6 slots populated, maximum: ~4.6 kg (10 lb)

Available Processor Modules
Intel® x86 architecture (LDS1100)
   Intel Core i7-620LE at 2.0 GHz, 2-GB DDR3 SDRAM and 4-GB flash
Intel x86 architecture (SBC1101)
   Intel EP80579 SoC at 1.20 GHz, IA-32 core
   512-MB DDR2 SDRAM and 4-GB flash
Graphics coprocessor (GPM1101) 
   AMD M98-XT GPU at 550 MHz
   1-GB DDR3 SDRAM
Graphics coprocessor (GPM1100)
   AMD M96 GPU at 550 MHz
   1-GB DDR2 SDRAM

Available FPGA Modules
Xilinx Virtex-5 XC5VLX30T (SCFE1102)
   256-MB DDR2 SDRAM and 32-MB flash
Custom engineering available on request.

Available External I/O
Ethernet I/O interface: Gigabit Ethernet
Serial I/O interface: USB, RS-232, RS-422, RS-485
Video I/O interface: DVI-D, VGA
Analog I/O interface: 14-bit quad ADC/DAC
General-purpose I/O interface: LVDS, LVTTL
Custom engineering
    I/O daughtercard design kit available on request.
    Custom services available on request.

Available Internal Storage 
Standard 2.5” SATA hard-disk compatible
Hard-disk drive (HDD): 250-GB
Solid-state disk (SSD): 250-GB

Internal Communications 
PCIe x4 switch fabric : 8 Gbps full-duplex per card
Processor and I/O interconnect: Module-dependent

Environmental
Temperature
   Operating*: -30°C to +50°C
   Storage: -40°C to +85°C
Humidity: 15-90% RH non-condensing
Liquid cooling  
    Up to 300W heat dissipatio
    Quick disconnect, dripless connectors
*Operating temperature range stated is for the liquid cooled chassis.
Conduction or convection cooling
   Consult factory to determine thermal capacity for your environment.

Power
Power and I/O connectors
    Ultra-miniature with MIL-STD-38999 performance
Power supply unit: 360W
Electrical: 28V DC input