• Ships as a fully integrated system, based on the Ensemble™ 1000 system architecture and modules with all supplied hardware pre-configured
• Multiple plugin modules
• PCI Express® backplane with four lanes of PCI Express bandwidth
• Rugged features, including o-ring sealing, and EMI isolation, high-reliability connectors, extended temperature ranges, and locking modules

• Man-pack chassis for SWaP-constrained applications
• 1/15 the size of full ATR, 1/3 the size of 1/4 ATR (short)
• Multiple supported confi gurations
• High-bandwidth, non-blocking PCI Express® architecture
• Rugged convection-cooled or cold-plate mountable design for deployment in harsh environments

Available Processor Modules
Intel x86 architecture
   Intel Tolapai SoC: At 1.20 GHz
   IA-32 core: 1-GB DDR2 SDRAM and 4-GB fl ash
Graphics co-processor
   MXM specification: 3.0 GPU modules
FPGA: Xilinx Virtex-5
   XC5VLX30T 256-MB DDR2 SDRAM and 32-MB fl ash
Custom engineering: Available on request

Available External I/O
Processor cards: Gigabit Ethernet and RS-232/485, USB
Graphics: DVI display interface
FPGA: Gigabit Ethernet, RS-232/485, 22x LVDS pairs, 8x LVTTL
Custom engineering
   Design-kit and custom services available on request

Available Internal Storage
Hard disk drive (HDD): 250-GB available
Solid state disk (SSD): 250-GB fl ash drive available

Internal Communications
Processor and I/O interconnect
   4-lane PCI Express per module
   8 Gbps aggregate

Power and I/O Connectors
Ultra-miniature with MIL-STD-38999 performance

Electrical: 12V DC input

Physical Specifications
Size (excluding connectors): 114 x 137 x 48 mm (4.5” x 5.4” x 1.9”)
Weight (estimated): ~1300g (~2.9 lb)
Cooling
   Natural convection: Consult factory
   Forced convection: Consult factory

Operating System Support
CentOS Linux 5.3