Specifications
FPGA Compute Nodes
FPGA compute nodes: 3
FPGA processor: Xilinx Virtex-5 XC5VLX330T
QDRII SRAM
Capacity per FPGA: 36 MB
Bandwidth per FPGA: 7.2 GB/s full-duplex (peak)
DDR2 SDRAM
Capacity per FPGA: 1 GB
Bandwidth per FPGA: 6.4 GB/s (peak)
Serial RapidIO ports per FPGA 1
Fiber links
2 pairs at 10 Gbps each, full-duplex (1 on each of 2 FPGAs)
850 nm multi-mode fiber with LC via pluggable
SFP+ module connectors
Copper serial links per FPGA
4 at 3.125 Gbaud from FCN2 to the other onboard FPGAs, full-duplex
4 at 3.125 Gbaud off board (12 total to front panel)
8 at 3.125 Gbaud off board (24 total to the backplane)
LVDS lines per FPGA
16 pairs to a front-panel connector (48 pairs total)
Freescale MPC8640 Processor
PowerPC Compute Nodes
1 MPC8640 processor, 1.067-GHz single-core
DRAM
Memory capacity: 1-GB DDR2 SDRAM, 533 MHz
Memory BW: 8.5-GB/s peak
Flash
Memory capacity: 128-MB application flash
Ethernet port: 100 MB to a front-panel connector
Serial port: RS-232 to a front-panel connector
Electrical/Mechanical
Input voltage
48 VDC 5V (for system management)
Power: 190W (high typical, depends largely on application IP)
Dimensions: M155 format
Slot spacing: 1.057 in
Environmental
Minimum airflow*(per slot at sea level)
28 CFM per stacked pair
Temperature*
Operating: 0°C to 35°C
Storage: -55°C to +85°C
Rate of change: 5°C/min
Humidity: 5-95% (non-condensing)
Vibration
Random: 0.02g2/Hz, based on 20 to 2,000 Hz, 1 hr/axis
Shock: 50g in all axes, 11 ms, half-sine
Altitude*
Operating: 0-30,000 ft
Storage: 0-50,000 ft
Salt/Fog: Consult factory
*As altitude increases, air density decreases and, therefore, the cooling effect of a particular number of CFM decreases. Different limits can be achieved by trading among temperature, altitude, frequency, and airflow.