• Comprised of three module types: system controller hub (SCH), data-plane switch (DPS), and payload modules, which can include processing modules, I/O, carriers, or combinations of both
• Five types of independent planes: IPMI-based system management plane, Gigabit Ethernet control plane, high-bandwidth data plane for direct support of multi-stage processing, sensor plane with associated sensor control-plane interface, and daisy-chain expansion plane
• Compliance with VITA 46 and 48 standards (VPX-REDI), conduction-cooled versions
• MultiCore Plus® software environment, which offers application portability among Mercury platforms and incorporates open standards such as Linux® and the Eclipse™  IDE
• Mercury MathPack software package with algorithm suite, Scientific Algorithm Library (SAL), in single-core and multi-core (MC SAL) versions

• Scalable computing power in a small form factor
• Suitable for operation in next-generation sensor platforms
• Rugged versions for deployment in harsh environments
• System flexibility from 5 types of communications planes
• Architected to meet OpenVPX™ design principles

Software: MultiCore Plus Software Platform
    Development tools: MultiCore Plus and MathPack 1.0
    Operating system support: Linux®

Available Modules
High compute density
   Freescale MPC8640 Dual-core running at 1.067 GHz
   Xilinx Virtex-5 LX-330T or LX-110T
Carrier card: XMC site
Carrier card with FPGA: XMC site and Virtex-5 LX-330T
System controller hub: 1 GigE control plane switch, system management hub
Data-plane switch: 10-Gbps RapidIO

Internal Communications
RapidIO
   One 10-Gbps full-duplex link to each payload slot
Aurora, RapidIO, 10 Gigabit Ethernet
   Direct 10-Gbps full-duplex links among grouped payload slots
PCI Express
   Direct 16-Gbps full-duplex links between adjacent payload slots
Gigabit Ethernet
   1-Gbps full-duplex link to each payload slot
IPMI
   400-Kbps I²C link to each payload slot

12-Slot Air-Cooled Chassis
Size (excluding connectors)
   7U 19-in rackmount chassis
   Height: 12.22 in
   Width: 16.45 in
   Depth: 17.0 in
Card cage: 12 slots on 1-inch pitch
Power supplies
   Two, each with 750W max output
Cooling
   Forced convection (15 CFM min per slot)
   ~60W per slot at 50°C inlet temperature

Air-Cooled Chassis Environmental
Temperature
   Operating: 0°C to 50°C at up to 10,000 ft MSL
   Storage: -40°C to +100°C
Humidity: 3-95% relative humidity, non-condensing
Shock
   MIL-S-901 (15g at 40 ms, 30g at 20 ms, 100g at 5 ms)
Vibration
   MIL-STD-167-1, Telcordia GR-63-CORE (NEBS)