• Two PowerXCell 8i processors, each running at 3.2 GHz for 205 single-precision GFLOPS in the SPE array
• Total of 410 GFLOPS of performance on the system
• Two companion chips provide high-speed bridges from processors to two PCI Express® x8 channels and two Gigabit Ethernet interfaces
• Front panel access to AC input, Gigabit Ethernet, USB, local power control, soft reset, power/alert/status LEDs, serial interface, and PCIe connector panels
• 4 GB of DDR II DRAM per processor, with optional support of up to 16 GB per processor
• MultiCore Plus™ SDK available for optional purchase

• Flexible high-performance solution based on the PowerXCell 8i processor
• Outstanding performance for HPC applications
• Designed for distributed processing
• Optional Cell-optimized software for enhanced application performance and developer productivity
• Designed to meet the needs of a wide variety of rugged platforms

Dual Cell BE Processors
PPE core: IBM® 64-bit Power Architecture™
   L1 cache size: 32 KB instruction; 32 KB data
   L2 cache size: 512 KB
SPEs: 8
   Local store: 256 KB
   Registers: 128 x 128 bits wide
EIB: 205 GB/s sustained aggregate bandwidth
Processor internal clock speed: 3.2 GHz
Processor-to-memory bandwidth: 25.6 GB/s
Processor-to-processor coherent interface: 20 GB/s in each direction

Memory
DDR2 memory
   Each processor
        Base system includes 4 GB per processor. Organized as
        4 DIMM sockets per processor, 2 DIMMs per channel.
        Supports 1, 2, or 4 GB DIMMs for a maximum of 16 GB per processor.
DDR2 memory (optional)
       Each companion chip 1 GB DIMM
ECC support
   Single-bit correct; double-bit detect on DDR2
Flash: 32 MB
NVRAM: 1 MB
Flash drive (optional): 8 GB

Hard Disk (Optional)
Hard disk controller
   SAS Controller via PCIe plugin card (consumes one slot)
Number of hard disks
   1 (maximum) 73 GB

I/O Subsystems
Serial ports: 1
USB ports: 2
Ethernet ports: 2 10/100/1000 MB
Supports advanced RAS system management via a dedicated
      Ethernet connection.

Expansion Options (Optional)
Plugin cards
   2 PCIe 8x electrical, 16x mechanical full-sized cards
   25W maximum; consult factory for higher power cards.

System Management
System Management Module
Baseboard Management Controller

MultiCore Plus SDK Software (Optional)
(32/64-bit application support)
MCF (MultiCore Framework): PPE/SPE
TATL™ (Trace Analysis Tool and Library): PPE/SPE
SAL (Scientific Algorithm Library): PPE/SPE
PixL™ (Image Processing Algorithm Library): PPE
MCPDIAGS (MultiCore Plus Diagnostics): PPE/SPE
SPEAD-K (SPE Assembly Development Kit): SPE
Linux operating system

Operating System
FedoraCore Linux
Red Hat Enterprise Linux (RHEL) v5.2 (optional)

Physical
Depth: 19 in
Width: 17 in base, 17.092 with cover (19-inch EIA rackmount)
Height: 3.48 in (2U)
Weight: <60 lb

Airflow
Front to rear
Not to exceed 100 CFM at MSL, 45°C

Noise    Complies with ETS 300 753
Electrical    100-240VAC, 50/60 Hz

Power Consumption
Idle: 310W
Typical: 340W
Maximum: 580W (fully configured)

Environmental
Ambient temperature: 0°C to 45°C
Humidity: 5-95% non-condensing
Altitude: 10,000 ft
Shock: 15g, 11 ms, sawtooth
Vibration: 10-2000 Hz at 0.004g2/Hz

Compliance
European Directive 2002/95/EC
      (RoHS 5/6 Server Exemption Directive)