Features

• 2 PowerXCell™ 8i processors, each running at 3.2 GHz
• Total of 410 GFLOPS
• 2 Companion Chips provide high-speed bridges to PCI Express and Gigabit Ethernet
• Optional support for SAS magnetic or flash module
• Expansion options for plugin cards or PCIe extender
• Optional MultiCore Plus SDK (software development kit)

Benefits

• Flexible computing solution based on the PowerXCell™ 8i processor
• Outstanding performance for HPC applications
• Designed for distributed processing
• Optional Cell-optimized software for enhanced application performance and developer productivity
• Enhanced features, improved performance, and reduced power, compared to previous version

Specifications

Dual PowerXCell 8i Processors
PPE core: IBM® 64-bit Power Architecture™
   L1 cache size: 32 KB instruction; 32 KB data
   L2 cache size: 512 KB
SPEs: 8
   Local store: 256 KB
   Registers 128 x 128 bits wide
EIB: 205 GB/s sustained aggregate bandwidth
Processor internal clock speed: 3.2 GHz
Processor-to-memory bandwidth: 25.6 GB/s
Processor-to-processor coherent interface: 20 GB/s in each direction

Memory
Processor
   DDR2 memory
   Each processor
      Base system includes 4 GB per processor
      Organized as 4 DIMM sockets per processor,
         2 DIMMs per channel
      Supports 1-, 2-, or 4-GB DIMMs for a maximum of
         16 GB per processor
Southbridge
      DDR2 memory (optional)
         Each companion chip: 1-GB DIMM
      ECC support
         Single-bit correct; double-bit detect on DDR2
   Flash: 32 MB
   NVRAM: 1 MB
   Flash module (optional) 8 GB

Hard Disk (Optional)
Hard disk controller
      SAS Controller via PCIe plugin card (consumes one slot)
Number of hard disks: 1 (maximum)

I/O Subsystems
Serial ports: 1 (dedicated for management functionality)
USB ports: 2
Ethernet ports: 2 10/100/1000 Mb
Supports advanced RAS system management via a dedicated
      Ethernet connection.
InfiniBand® option (this makes 3 Ethernet ports in total)
10 Gigabit Ethernet option

Expansion Options (Optional)
Plugin cards
   2 PCIe x16 mechanical, x8 electrical full-size cards
   25W maximum*
   PCIe extender
*Consult factory for higher power cards.

System Management
System Management Module
Baseboard Management Controller

MultiCore Plus SDK Software (Optional)
(32/64-bit application support)
MCF (MultiCore Framework): PPE/SPE
TATL™ (Trace Analysis Tool and Library): PPE/SPE
SAL (Scientific Algorithm Library): PPE/SPE
PixL™ (Image Processing Algorithm Library): PPE
MCPDIAGS (MultiCore Plus Diagnostics): PPE/SPE
SPEAD-K (SPE Assembly Development Kit): SPE

Operating System
Fedora Linux®

Size
Length: 30 in
Width: 17.15 in (19-inch EIA rackmount)
Height: 1.73 in (1U)

Weight: <45 lb

Airflow: Required <90 CFM @ MSL

Noise: Complies with ETS 300 753

Electrical: 100-240VAC, 50/60 Hz

Power Consumption
Idle: 310W
Typical: 410W
Maximum: 440W
Maximum: 580W (fully configured)

Environmental
Ambient temperature: 0°C to 45°C
Humidity: 5-80% non-condensing
Altitude: 10,000 ft

Compliance
European Directive 2002/95/EC
   (RoHS 5/6 Server Exemption Directive)
Safety: UL/EN/IEC 60950-1:2001
EMC: EN 55022, EN 61000, EN 55024:1998, FCC Class A, VCCI, AS, NZS, CISPR22:2006