• Dual dual-core Intel® Xeon® processors in a conduction-cooled format
• Architecture supports 4-way symmetric multiprocessing (SMP)
• I/O interfaces include quad Gigabit Ethernet, RS-232 serial I/O, high-speed serial ATA-150 (SATA), and USB 2.0
• Three PCI Express® x8 links with bandwidths of up to 2 GB/s
• 667-MHz front side bus
• Dual DDR2-400 ECC memory interfaces that can access up to 4 GB of memory

• State-of-the-art performance levels for compute-intensive applications
• Brings server-level performance to a single VME slot
• 4-way SMP configuration eases porting from existing configurations
• Abundant I/O interfaces with easy connectivity
• Single PMC-X/XMC expansion site for added versatility
• Bridges the gap from legacy to industry-standard I/O
• Conduction-cooled versions

Dual-Core Intel® Xeon® Processors
Two Dual-Core Intel® Xeon® processors ULV at 1.66 GHz

Intel® E7520 Memory Controller Hub
PCI Express (PCIe): Three x8 links
Dual-channel memory interface: 2 GB or 4 GB DDR2-400
Processor system bus interface: 667 MHz

Intel® 6300ESB I/O Controller Hub
16550-compatible UARTs
Two USB 2.0 ports
IDE port with 2-GB flash drive

Firmware Hub: BIOS™ storage (write-protected)

Gigabit Ethernet
One Intel® 82571EB dual-port Gigabit Ethernet MAC/PHY chips
Two link ports available at the P2 backplane

Serial RS-232 I/O
Two asynchronous serial RS-232 port interfaces at P2 backplane

USB 2.0
Two USB interfaces at P2 backplane

SATA
SATA port at P2 backplane

GPIO
8 GPIO pins available on the J2 backplane (5V tolerant)

PMC-X/XMC Site
IEEE 1386/1386.1 PCI mezzanine card
VITA 39 PMC with PCI-X running at up to 66 MHz
VITA 42.3 XMC switched mezzanine card with PCI Express
User I/O pins routed to J2 per VITA 35
Note: Only hybrid PMC-X/XMCs with single J15 populated are supported. PMC-X/XMCs or XMCs with J16 populated are not compatible.

Backplane Interface
System controller or peripheral card operation through the backplane bridge
VME64 Tundra® Tsi148™ PCI-to-VME bridge
Note: The VX6-200CC brings SATA signals to connector P1 and is not compliant with ANSI/VITA 1-1994(R2002), possibly requiring the use of a special backplane.

Dimensions
Form factor: 6U VME per VITA 41
Height: 9.2 in (233 mm)
Depth: 6.3 in (160 mm)

Weight: 4.98 lb (2.26 kg) conduction-cooled

Power Requirements
5V, 3.3V: Required from backplane
±12V: As required by PMC module

Power Consumption*
Dual processor, dual memory configuration
   5V: 34W
   3.3V: 42W
   Total: 76W
Single processor, dual memory configuration
   5V: 17W
   3.3V: 42W
   Total: 59W
* Power consumption values are estimates of worst-case conditions.

Environmental Specifications
Temperature
   Operating: -40°C to +71°C, conduction-cooled
   Storage: -40°C to +71°C, conduction-cooled
Humidity: 0-100%, conduction-cooled (conformal coat)
Shock: 50 z-axis; 80g x/y axis; 11 ms half-sine
Vibration: 0.1g2/Hz at 5-2000 Hz, 1 hr/axis, conduction-cooled
Altitude
   Operating: 0-70,000 ft, Level 3 conduction-cooled
   Storage: 0-100,000 ft, conduction-cooled

Standards Compliance*
Safety: Designed to meet standard UL1950/60950
Emissions: Designed to meet FCC Part15, Sub-Part A
*VX6-200R SBC is designed to be certified within a system environment.