Specifications
Dual-Core Intel® Xeon® processors
One or two dual-core Intel® Xeon® processors ULV at 1.66 GHz
Intel® E7520 Memory Controller Hub
PCI Express (PCIe): Three x8 links
Dual-channel memory interface: DDR2-400
Processor front-side bus interface: 667 MHz
HI1.5 Hublink interface between Intel® E7520 MCH and Intel® 6300ESB ICH: 266 MHz
Intel® 6300ESB I/O Control Hub
Two independent SATA host controllers
32-bit PCI connectivity
Up to 150 MB/s transfer rates
16550-compatible UARTs
Four USB 2.0 ports
IDE controller with support for Ultra DMA-100 mode transfers
Advanced programmable interrupt controller (APIC)
Enhanced DMA controller
SMB host controller with I²C interface
PCI-X interface to backplane: 64-bit, 133 MHz
LPC interface
Dual-channel DDR SDRAM SO-DIMM sockets
Registered ECC DDR2-400 memory bus per socket
2, 4, 6, or 8 GB memory modules available
Firmware hub
BIOS™ storage
PCI/PCI-X/PCIe interfaces
Two PCIe interfaces controlled through the E7520 MCH
Two 64-bit PCI-X interfaces controlled through a NEC µPD720400
PCIe-to-PCI-X bridge
Gigabit Ethernet
Two Intel® 82546GB dual-port Gigabit Ethernet Controllers
With two fully integrated MAC and PHY combinations
Two link ports at J3 for PICMG® 2.16 compliance
Two link ports available at front panel (dual RJ-45 connector) or backplane
64-bit PCI-X interface
Serial RS-232 I/O
Optional two asynchronous serial RS-232 ports at front panel
(Dual RJ-45 connector)
Two asynchronous serial RS-232 port interfaces at backplane
Serial ATA
Dual SATA connector at front panel
Primary ATA hard disk
Onboard HDD mounting sled
Accepts CompactFlash® via adapter
USB 2.0
Single USB 2.0 Type A connector at front panel
Two USB interfaces at backplane
SVGA graphics
ATI RAGE™ Mobility™ M graphics with 4-MB on-chip SDRAM
Resolutions up to 1280 x 1024
HD-15 VGA connector at front panel
PMC-X/XMC site
IEEE 1386/1386.1 PCI mezzanine card
VITA 39 PMC with PCI-X running at up to 133 MHz
VITA 42.3 XMC switched mezzanine card with one 8x PCI Express
IPM Interface
Hitachi® H8S/2168 baseboard management controller (BMC)
CompactPCI version PICMG 2.9 R2.0 compliant
Dual IPMB interfaces at the backplane
Backplane Interface
CompactPCI system controller or peripheral card operation through backplane bridge
PLX PCI6540 PCI-X to PCI-X bridge: 64-bit, 133 MHz
Dimensions
Form factor: 6U Compact PCI per PICMG 2.0, R3.0
Height: 9.2 in (233 mm)
Depth: 6.3 in (160 mm)
Weight: 1.64 lb (0.743 kg)
Power Requirements
5V, 3.3V: Required from backplane
±12V: As required by PMC module
Power Consumption*
Dual processor, dual memory configuration
5V: 34W
3.3V: 42W
Total: 76W
Single processor, dual memory configuration
5V: 17W
3.3V: 42W
Total: 59W
Single processor, single memory configuration
5V: 17W
3.3V: 36W
Total: 53W
*Power consumption values are estimates of worst case condition.
Environmental Specifications
Temperature
Operating: 0°C to 55°C (270 LFM minimum)
Non-operating: –40°C to +85°C
Humidity
Operating: 10-90% at 40°C (non-condensing)
Non-operating: 5-95% at 40°C (non-condensing)
Shock
Operating: 20g z-axis, 32g x-, y-axes; 11 ms half-sine
Vibration
Operating: 0.003g2/Hz (20-2,000 Hz)
Altitude
Operating: 0-15,000 ft (0-4572 m)
Standards Compliance*
Safety: Designed to meet standard UL1950/60950
Emissions: Designed to meet FCC Part 15, Sub-Part A
RoHS: Designed to meet RoHS 5 of 6 compliance
*The CX6-200 SBC is designed to be certified within a system environment.