Specifications
Four DSP nodes
Texas Instruments TMS320TCI6482 signal processor: 1.2 GHz
Serial RapidIO interfaces
Four 1x serial RapidIO connections
1.25, 2.5, and 3.125 Gbps data rate support
EMIFA - Flash interface (connected on single node only)
4 MB Intel StrataFlash®
DDRII memory support (connected to all four DSPs)
64 MB Infineon® DDRII SDRAM
32 MB ×16-bit
250 MHz clock (1 GBps data rate)
I2C EEPROM support
Power generation and distribution
12V payload power, 3.3V IPMI power
12V input dc-to-dc modules to supply 1.2V, 1.8V, and 3.3V
Linear regulator for 1.2V and 2.5V
Clock generation and distribution
25 MHz clock input reference for:
TMS320TCI6482 RGMII
TMS320TCI6482 DDRII
BCM5389 Gigabit Ethernet switch
BCM5466R Gigabit Ethernet transceiver
125 MHz clock input reference for TMS320TCI6482 serial RapidIO
50 MHz clock input reference for TMS320TCI6482 core
IPMI peripheral manager
Voltage monitor
Geographical address monitor
Temperature monitors
Power/reset control
DSP EEPROMs
FRU EEPROM
Status LEDs
Test/development
14-pin JTAG/emulator connector
ICT test points
Jumper plugs (configuration changes)
LEDs
Mechanical/dimensions
Compliant to AMC.0, Rev. 1.0
Width: 28.96 mm
Depth: 28.53 mm
Height: 73.81 mm
Supports AMC B+ bays
Full-height AMC
Single-width AMC
B+ edge connector
Supports hot swap
Four front-panel LEDs per AMC.0
Out of service (OOS) LED - red
User LED 2 (LED2) - green
User LED 3 (LED3) - yellow
Hot swap LED (H/S) - blue
Lower ejector handle switch
Hardware address
Software support
DSP/BIOS
OSEckTM (through third-party)
Environmental
Temperature
Operating: 0°C to 55°C at 10,000 ft
Storage: -40°C to +85°C
Humidity
Operating: 10-90% non-condensing
Vibration: 0.003g2/Hz, 20-2000 Hz, 1 hr/axis
Shock: x and y axes: 32g; z axis: 20g; 11 ms, half-sine
Air flow: 10 CFM per slot
Power consumption
12V payload power: 30W max; 20W typical
3.3V management power: 0.5W max; 0.25W typical