Specifications
Electrical/Mechanical Specifications
DLK6P
Input voltage (VDC): 5 ± 0.25
Power consumption (W): 3
Weight (lb): 0.74
Dimensions (in)
Length: 4.78
Width: 3.74
Height*: 1.50
DLK12P
Input voltage (VDC): 5 ± 0.25
Power consumption (W): 6
Weight (lb): 1.6
Dimensions (in)
Length: 9.59
Width: 3.74
Height*: 1.70
DLK18P
Input voltage (VDC): 5 ± 0.25
Power consumption (W): 18
Weight (lb): 2.4
Dimensions (in)
Length: 14.40
Width: 3.74
Height*: 1.70
DLK20P
Input voltage (VDC): 5 ± 0.25
Power consumption (W): 26
Weight (lb): 4.5
Dimensions (in)
Length: 16.00
Width: 3.74
Height*: 1.85
*Height for DLK12P, DLK18P, DLK20P modules includes rigid/flex PCB.
An additional 0.8 in is required for convection air cooling.
Commercial Environmental Specifications
Mercury offers multiple categories of environmental ruggedness for DLKP modules. The specifications detailed below are for the Interlink modules for standard commercial environments.
Operating temperature:
0°C to 40°C up to an altitude of 10,000 feet
(ambient air temperature above DLKP)
Storage temperature: -40°C to +85°C
Relative humidity: 10% to 90% (non-condensing)
As altitude increases, air density decreases, hence the cooling effect of a particular CFM rating decreases. Many manufacturers specify altitude and temperature ranges that are not simultaneous. Notice that the above operating temperature is specified simultaneously with an altitude. Different limits can be achieved by trading among altitude, temperature, performance, and airflow.
Contact Mercury for more information.
DLKP Configuration Rules
Physical Requirements
- DLKP modules mount on backplanes containing 160-pin (5-row) VME 64x connectors with Harting shrouds. Shrouds manufactured by Harting are known to be compatible with DLKP modules. Consult Mercury for information on the compatibility of a particular backplane.
- A minimum of 2.5 in of clearance must exist between the VME backplane and the back of the chassis enclosure including space required for convective airflow.
Configuration Requirements
- Slots spanned by Interlink modules may be unoccupied.
- VME boards inserted in slots spanned by the Interlink must either have a valid RACEway interface, or have no electrical connection on the affected rows of the P2 connector. If the board has no RACEway ports, rows A, C, D, and Z must be unconnected; if only one port is present, then only one set of rows A and C or D and Z should be connected.
- Interlink modules may not span split backplanes (that is, electrically isolated backplanes in the same chassis).
- DLKP modules cannot be connected to ILKP (single-port RACEway) modules.